SIXUNITED made its debut at Hong Kong LEAP EAST 2026 and DCA 2026, showcasing both its computing infrastructure and smart terminals in one go!
Release time:
2026-07-09
From July 8 to 10, the Hong Kong Convention and Exhibition Centre became the global stage for the technology industry. SIXUNITED made its debut at two major exhibitions: the Asia Data Center Summit & Industry Exhibition (DCA 2026), which focuses on AI computing infrastructure, and the International Technology and Information Technology Expo (LEAP EAST 2026), bringing together tech giants from around the world. From core server motherboards to end-user office devices, SIXUNITED adopted a “one city, two exhibitions, dual-track advancement” strategy to showcase to global customers its comprehensive product portfolio and R&D capabilities—spanning from underlying computing power to high-end terminal devices.
PART 01 LEAP EAST2026
As a premier technology event connecting the Middle East and the Asia-Pacific markets, this year’s exhibition made its debut in Hong Kong, bringing together over 400 global exhibitors. As a builder of Saudi Arabia’s AI infrastructure supply chain, SIXUNITED showcased its flagship smart terminal products at booth H3.R10, highlighting its deep expertise in commercial computing, mobile office solutions, and AI edge computing, and conveying the strength of China’s intelligent manufacturing to the world.
Ultra-thin and lightweight business laptop
On a three-day, two-city business trip, the laptop often weighs down the briefcase most heavily. The xN25-140M2-YDX boasts an ultra‑slim, lightweight design—weighing under 1 kg and measuring just 15.95 mm thick—built with magnesium alloy for its A/C/D surfaces. It features a 14-inch 16:10 display with up to 2K OLED resolution, supports all major platforms from Intel and AMD to Qualcomm, and is powered by a robust 60 Wh battery paired with high‑speed LPDDR5 memory and an expansive 178° hinge. In premium business settings, performance and portability no longer have to be at odds.
Everyday business use places diverse yet practical demands on laptops: portability for commuting, seamless collaboration in meetings, and dependable battery life. The xN25-140M-YD, a semi‑metallic all‑in‑one, weighs as little as under 1 kilogram and features an optional 14‑inch 16:10 2K OLED display. Its 180° hinge enables full flat‑laying, making screen sharing and effortless collaboration at the conference table a breeze. With full‑platform compatibility across Intel, AMD, and Qualcomm, it meets the computational needs of various roles. Paired with flexible dual‑battery options—60Wh or 50Wh—it adapts to different usage intensities, delivering stable performance and pragmatic specs that make it a reliable choice for mainstream business environments.
The leading choice for ultra-compact desktop computing
Modern office environments demand greater tidiness and deployment efficiency. The xB60-H01-JL delivers seamless, unobtrusive deployment in an ultra‑compact 0.5‑liter form factor. It supports Intel and AMD platforms across multiple generations with a configurable 45W TDP, offers dual DDR5 memory slots and dual M.2 SSDs for flexible, full‑lifecycle expansion, and features dual RJ45 Gigabit Ethernet ports to meet internal–external network isolation requirements. With Thunderbolt 4 and a rich array of USB‑A ports, it accommodates a wide range of peripherals, is compatible with Windows 11 and Linux, and spans all use cases—from office workstations to industrial control systems—providing system integrators and enterprise IT procurement teams with a desktop computing powerhouse that balances performance, expandability, and deployment flexibility.
The xB19-P06-CH mini‑box, with a compact 0.7L form factor, supports multiple platforms including Intel, AMD, and Zhaoxin, and features a maximum TDP of 45W. It offers dual SSD storage, dual Gigabit Ethernet ports, and a rich array of USB and Type‑C interfaces (with optional TBT4/USB4 support). This versatile device is well suited for applications such as whole‑home smart hubs, home and studio control centers, data‑security sandbox appliances, automated code‑pipeline workflows, and developer‑focused automation labs, delivering exceptional computational power in space‑constrained environments through its ultra‑compact design.
High-Performance Mini AI Workstation
Edge AI deployment often faces the dual challenges of limited space and insufficient computing power. The AXB35-02-H06-YC, with its compact 4-liter form factor, features an NPU delivering 50 TOPs of dedicated AI compute, up to 96GB of vRAM allocated from a 128GB 8000MT/s memory subsystem, and dual M.2 PCIe 4.0×4 high-speed storage. Its 132W TDP thermal design ensures stable operation under full load. Developed by SIXUNITED, its multi-machine cluster technology enables the creation of a personal mini supercomputing center via USB4/RJ45 cabling, providing compact yet powerful computational support for local inference and private deployment of large models, thereby meeting the stringent requirements for data privacy and low latency in scenarios such as smart factories and R&D labs.
PART 02 Asia Data Center Summit and Industry Exhibition
As a world-leading event in the data center industry, the Asia Data Center Summit and Industry Exhibition focuses on infrastructure innovation driven by the AI computing power boom, covering cutting-edge fields such as liquid cooling technology, green energy, cloud-network integration, and edge computing. SIXUNITED showcased three of its high-performance computing motherboards at Booth Hall 3G (3G-B12-06), presenting end-to-end computing solutions—from workstations to servers—to the most influential technology buyers, operators, and investment institutions in the Asia-Pacific region.
01 Intel Xeon Workstation Motherboard
Enterprise‑class workstations demand a robust x86 ecosystem and well‑balanced I/O configurations. The W890E1 is equipped with the Intel W890 chipset, supporting the latest Intel Xeon 600 series processors—up to 86 cores with a TDP of 350W. It features eight DDR5 ECC RDIMM slots that support both MRDIMM at 8,000 MT/s and RDIMM at 6,400 MT/s, offering up to 2 TB of memory capacity to meet the demanding requirements of large‑scale simulations and data analytics. Seven PCIe ×16 expansion slots, paired with dual 10GbE and 2.5GbE network ports and two USB‑C ports, provide a high‑bandwidth, low‑latency I/O foundation for professional computing, hyper‑convergence, and virtualization workloads.
02 AMD Ryzen Threadripper Workstation Motherboard
The demand for multi-core parallelism and high-speed scalability in professional workstations is growing ever more urgent. The WRX90E1 workstation motherboard, built to the EEB standard, supports AMD Ryzen Threadripper PRO 7000/9000 WX series processors (sTR5), offering up to 96 cores and 192 threads with a TDP of 350W, delivering industry‑leading compute density for cloud computing, virtualization, and distributed storage. With eight DDR5 DIMM slots supporting 6400 MT/s ECC RDIMMs, seven PCIe ×16 expansion slots, and two USB4 and MCIO ×8 high‑speed interfaces, it effortlessly handles demanding workloads such as professional rendering, scientific computing, and AI model training.
03 AMD EPYC (Turin) Square Motherboard
The newly launched square‑shaped motherboard features an innovative 427×308.5 mm form factor, with a depth reduced by 71.5 mm compared to conventional L‑shaped boards and a footprint shrinkage of 13.2%. This design leverages standard chassis widths, eliminating the need for costly modifications, while also creating unobstructed straight‑through airflow for front‑mounted GPUs/DPUs and liquid‑cooling modules. Compatible with the OCSP 3.0 open standard, it offers full pin‑out on its MCIO ports to support PCIe 5.0/6.0. Its modular partitioned architecture enables a single board to span both 2U general‑purpose servers and 4U AI servers, cutting R&D costs by 30%–50% and providing a cost‑effective, high‑performance hardware foundation for next‑generation data centers.
PART 03 One City, Two Exhibitions: A Full-Stack Showcase
At this year’s two major industry events held concurrently at the Hong Kong Convention and Exhibition Centre, SIXUNITED comprehensively showcased its full‑dimensional business portfolio spanning computing infrastructure and intelligent terminals. Leveraging its integrated vertical capabilities—from underlying computing power to end‑device solutions—SIXUNITED combines standardized, in‑house technologies with robust implementation expertise to deliver seamless, high‑efficiency end‑to‑end AI hardware and software solutions for customers worldwide. July 10 marks the final day of LEAP EAST 2026; we warmly invite you to visit the SIXUNITED booth H3.R10, engage in in‑depth face‑to‑face discussions with our expert technical team, explore new opportunities in computing power, and jointly open up fresh avenues for collaboration.
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