XB70-H02/H03/H04-BY-Shanghai Sixunited Intelligent Technology Co,Ltd

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XB70-H02/H03/H04-BY

Metal chassis + Plastic panel 1L/ 178×176.2×38.9mm intel® vPro UMA 65W or 45W CPU+30W dGPU 2×SODIMM + 3×M.2 2280 SSD Toolless detached/ Padlock/ DDR&SSD Door 8×USB-A + 1×USB-C, ≥3×display

Technical specifications
Product Introduction
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Commodity name: XB70-H02/H03/H04-BY

Metal chassis + Plastic panel 1L/ 178×176.2×38.9mm intel® vPro UMA 65W or 45W CPU+30W dGPU 2×SODIMM + 3×M.2 2280 SSD Toolless detached/ Padlock/ DDR&SSD Door 8×USB-A + 1×USB-C, ≥3×display

Specifications
Platform	Intel WCL \| ARL/MTL-H \| RPL/ADL-H \| ADL-N/TWL RPL/ADL-S + H610/B660/Q670 ARL-S + H810/B860/Q870 AMD FP6, CZN/LCN/BCL/RNR
Memory	2×DDR4/DDR5 SO-DIMM (ADL-N only 1×)
Storage	3×M.2 2280 SSD
WiFi/BT	M.2 2230 Wifi Module
Adapter	DC-IN, I9V/7.89A, 150W Max (follow CPU)
OS	Windows 11/ Linux
Front I/O	1×Audio Jack 1×USB-C (Data+DP/ full function option) 2×USB-A (Data) 2×USB2.0 1×Power Button, 1×Reset
Rear I/O	1×DC_IN 1×DP1.4 (DP++) 1×HDMI 2.1 (TMDS) 2×USB-A 2×USB2.0 1×1GLAN RJ45 (2.5GLAN option)
Expansion I/O	1×HHHL DGPU card (PCIe×16 Slot (×8 lanes) ) or IO1 (HDMI/DP/VGA/DVI/miniPD) + IO2 (RJ45/COM/LPT/USB...)
Vesa Mount	Support